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Dongguan chip factory SMT plus DIP post-soldering
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Product Overview
Fields of application
Technical Specifications
Related Products
Product Overview
Fields of application
It is widely used in automotive electronics, photovoltaics, consumer electronics, household appliances, aerospace and navigation, deepwater, military and other industries.
Technical Specifications
Overall size(mm):
42(W)1.6(H)
Weight (g):
15
Working range(mm):
customize
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