Introduction to the whole process of patch processing
Single-sided assembly: incoming material inspection + silk screen printing + solder paste (red glue) + patch + reflow (curing) + cleaning + inspection + repair
Single-sided mixed assembly: incoming material inspection + PCB side A screen printing solder paste (red glue) + patch + side A reflow (curing) + cleaning + plug-in + wave peak + cleaning + detection + repair
Double-sided assembly: Incoming material inspection + pcb side a screen printing solder paste (red glue) + patch + a side reflow (curing) + cleaning + flipping + side b screen printing solder paste (red glue) + patch + side b reflow (
Curing) or (dip+crest)+cleaning+testing+rework
Double-sided mixed assembly: incoming material inspection + PCB side B screen printing solder paste (red glue) + SMD + B side reflow (curing) + cleaning + flipping + side A screen printing solder paste (red glue) + SMD + B surface reflow (
Curing) or (dip+crest)+cleaning+testing+rework
Silk screen printing: Its function is to print solder paste or patch glue onto the pads of the PCB to prepare for the soldering of components. The equipment used is a screen printing machine (screen printing machine) located in
The front end of the SMT production line. Glue dispensing: It drips glue onto the fixed position of the PCB. Its main function is to fix the components to the PCB board. Equipment used
It is a dispensing machine located at the front end of the SMT production line or behind the testing equipment.
Mounting: Its function is to accurately install surface-mounted components to the fixed position of the PCB. The equipment used is a placement machine, located behind the screen printing machine in the SMT production line.
Curing: Its function is to melt the patch adhesive so that the surface assembly components and the PCB board are firmly bonded together. The equipment used is a curing oven, located in the smt production line
Behind the placement machine.
Reflow soldering: Its function is to melt the solder paste so that the surface assembly components and the PCB board are firmly bonded together. The equipment used is a reflow oven, located in the smt production line
Behind the placement machine.
Cleaning: Its function is to remove welding residues such as flux that are harmful to the human body on the assembled PCB board. The equipment used is a cleaning machine, and the position does not need to be fixed.
It can be online or offline.
Testing: Its function is to test the welding quality and assembly quality of the assembled PCB board. The equipment used includes magnifying glass, microscope, online tester (ict), flying
Needle tester, automatic optical inspection
(Aoi),
Rework: Its function is to rework the PCB board that has detected a fault. The tools used are soldering irons, rework workstations, etc., which are placed anywhere in the production line.