In the PCBA processing process, patch components and plug-in components will be used. SMD components are printed on the PCB board with solder paste and then solidified by reflow soldering. DIP plug-ins insert the components into the PCB board holes with a DIP structure. So what’s the difference between the two?

PCBA design

First of all, chip components are small in size and light in weight, and are easier to weld than plug-in components. The patch process has high reliability, low solder joint defect rate, high production efficiency, and reduces stray electric and magnetic fields. This effect is particularly obvious in high-frequency analog circuits and high-speed digital circuits. The DIP process has a low failure rate, strong anti-bump performance, and more stable product performance. For inserted components, it must be checked to see if there are any phenomena such as incorrect insertion, missing insertion, reverse insertion, etc.

In summary, SMT patching and DIP post-welding have their own characteristics. During the PCBA processing process, the two complement each other and form a complete PCBA production process. Dianjing Technology Co., Ltd. currently has 8 SMT lines and 4 back-end supporting production lines. It can do ICT and FCT testing. It has about 150 employees and the company’s R&D team of about 20 people. It provides customers with free PCBA development services. Those who have applied There are more than 20 patents.