It is said that quality is the lifeblood of an enterprise, and inspection of incoming materials is essential. Carry out sampling to inspect the quality of raw materials sent by suppliers, and make judgments to accept or reject the batch of products. So what should be tested for incoming materials during PCBA processing?

PCBA processing

Electronic components: The first is appearance inspection to see if performance, specifications, packaging, etc. meet the requirements. Then the solderability testing of electrical components mainly involves surface oxidation of electronic components. Currently, there are solder ball method, wetting balance experimental method, etc. The last step is to detect the coplanarity of the component pins. The horizontal deviation of the pins of SMT chip components should not be greater than 0.1mm. Otherwise, it will cause poor welding such as weak soldering and missing soldering of the pins of electronic components.

PCB circuit board: PCB size inspection, mainly including the diameter of the processing hole, whether the PCB edge size is within the tolerance range of the drawing, positioning holes, etc. PCB appearance inspection, whether there are impurities and wrinkles in the solder mask, and whether the circuit board wire width meets the requirements. PCB warpage detection, whether the circuit board has warping, distortion, etc. due to improper processing.

Incoming material inspection checks the source materials to prevent defective materials from flowing into the next process, adhering to the principles of “not accepting defective products”, “not producing defective products” and “not flowing out of defective products”.