With the rapid development of the electronics industry, SMT involves a wide variety of parts, many of which have formed common standards in the industry, especially IC components, whose packaging forms are constantly changing. So what is electronic component packaging?

SMT patch

The so-called packaging is the process of making chips into components. The package mainly has two functions. One is the interconnection function, which is to use the connection points on the chip to connect specific thin wires (usually gold wires, copper wires, aluminum wires) to the pins of the package shell. These pins It is also connected to other components through the wires of the printed circuit board to realize the connection between the internal chip and the external circuit; the second is the protection function. The chip must be isolated from the outside world to prevent impurities in the air from corroding the internal structure of the chip and causing electrical problems. The function is reduced, and the packaged chip is easy to install and transport, and is also convenient for SMT patch assembly.

The quality of the package directly affects the performance of the chip itself. Several common packages include SIP, DIP, SOP, SOJ, QFP, LCC, BGA, PGA, etc.