Introduction to commonly used testing equipment and their functions in Dongguan SMT chip processing

The process flow of SMT patch processing in Dongguan is complex and cumbersome, and problems may arise in every link. In order to ensure product quality, it is necessary to use various testing equipment to detect faults and defects and solve problems in a timely manner. Then in SMT patch processing.

The process flow of SMT chip processing in Dongguan is complex and cumbersome, and problems may arise in every link. In order to ensure that product quality is qualified, various testing equipment is needed to detect faults and defects and solve problems in a timely manner. So what are the common testing equipments used in SMT patch processing? What are their functions?
smt testing equipment

1. MVI (manual visual inspection)

2. AOI testing equipment

(1) Occasions where AOI inspection equipment is used: AOI can be used in multiple positions on the production line, and each position can detect special defects. However, the AOI inspection equipment should be placed in a position where the most defects can be identified and corrected as early as possible.

(2) Defects that AOI can detect: AOI is generally detected after the etching process of the PCB board, and is mainly used to find missing parts and redundant parts.

3. X-RAY detector

(1) Where the X-RAY detector is used: It can detect all solder joints on the circuit board, including solder joints invisible to the naked eye, such as BGA.

(2) Defects that the X-RAY detector can detect: The defects that the X-RAY detector can detect mainly include bridges after welding, voids, solder joints that are too large, and solder joints that are too small.

4. ICT testing equipment

(1) Occasions where ICT is used: ICT is oriented to production process control and can measure resistance, capacitance, inductance, and integrated circuits. It is particularly effective in detecting open circuits, short circuits, component damage, etc., with accurate fault location and easy maintenance.

(2) Defects that ICT can detect: It can detect problems such as weak soldering, open circuits, short circuits, component failures, and the use of wrong materials after welding.