As integrated circuit technology continues to advance, the requirements for integrated circuit packaging are becoming more and more stringent. I/O pins have increased dramatically, and power consumption has also increased. In order to meet market demand, ball grid array packaging – BGA packaging has appeared. So what are the characteristics of this package? Let the editor of the PCBA manufacturer tell you.

PCBA design

First of all, it has good assembly performance, co-planar welding and high reliability. At the same time, the assembly pins will not be deformed and have automatic calibration function during assembly. Secondly, the assembly cost is reduced, the PCB empty board usage area is reduced, the thickness is reduced by more than 1/2 than QFP, and the weight is reduced by more than 3/4. Finally, the BGA package has good electrical characteristics, small signal transmission delay, small waveform distortion, and greatly increases the frequency of use. Compared with traditional TSOP packaging, BGA packaging has a faster and more effective way to dissipate heat.

At present, the requirements for integrated circuit packaging are more stringent, and some traditional packaging can no longer meet the requirements. It was also the emergence of BGA packaging that it became the best choice for high-precision, high-performance, multi-pin packaging of CPUs, motherboard south bridges, north bridge chips, etc. For the PCBA industry, X-ray inspection methods are also added to check the internal welding conditions of BGA packages.